SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To suppress increase in voltage in comparison with a semiconductor device before mounting even after a semiconductor element is mounted on a sub-mount.SOLUTION: In a semiconductor device 20, a semiconductor element 1 is bonded to a sub-mount 13; the semiconductor element 1 includes an n-side electrode 6 and an n-type semiconductor region 2; the n-side electrode 6 is bonded to the sub-mount 13; and the n-side electrode 6 contacts the n-type semiconductor region 2. A quantity (atoms%) of Ga contained in the n-side electrode 6 in a region of the n-side electrode 6, which is separated from a rear face 2b of the n-type semiconductor region 2 by 5 nm and over is not more than 3×10times larger than a quantity (atoms%) of Ga contained in the n-type semiconductor region 2.