| 摘要 |
PROBLEM TO BE SOLVED: To provide a pickup device which is capable of surely and easily picking up a semiconductor chip from an adhesive sheet.SOLUTION: The pickup device includes: a backup body 1 which sucks and holds a lower surface of an adhesive sheet 3 by an upper surface thereof and has a plurality of push-up members provided therein movably in a vertical direction; a cam member 53 which successively pushes up the plurality of concentrically arranged push-up members while compressing springs so that push-up members located on an inner side of the backup body 1 are higher than those located on an outer side of the backup body; a contact detection sensor 16 which is located at the center of the plurality of push-up members pushed up by the cam body and detects heights of the push-up members pushed up; and a controller 18 which compares actual heights of the push-up members pushed up by the cam body with preliminarily set heights to calculate differences between the set heights and actual heights and operates the push-up members by the cam body on the basis of the differences so as to correct the actual heights. |
