发明名称 SOLDERING STRUCTURE OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a safe soldering structure of an electronic component, in which the strength of a terminal is secured without damaging other components by notches.SOLUTION: There is provided the soldering structure in which: a bus bar 5 has a hole 7 inside; and the bus bar 5 molded to an insulator 6 at the position of the hole 7 is soldered to a through-hole 4a of a substrate 4 by a solder 9 at a soldering part 8.
申请公布号 JP2013171725(A) 申请公布日期 2013.09.02
申请号 JP20120035188 申请日期 2012.02.21
申请人 AISIN SEIKI CO LTD 发明人 OGAWA YOSHINUKI
分类号 H01R4/02;H01R12/55 主分类号 H01R4/02
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