| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board capable of reducing a crosstalk between a differential signal via and a differential wiring.SOLUTION: A multilayer wiring board 1A has plural signal layers 3 and a ground layer 2. The multilayer wiring board has a first differential wiring 30A wired on a third signal layer 3C, and a second differential wiring 30B wired on a ninth signal layer 3I that is an upper layer than the third signal layer. The multilayer wiring board has a first differential signal via 12A connected to the first differential wiring, and a second differential signal via 12B connected to the first differential wiring. The multilayer wiring board has a third differential signal via 12C that is connected to the second differential wiring and whose stub 41 is terminated at an upper layer than the third signal layer. Furthermore, the multilayer wiring board has a fourth differential signal via 12D that is connected to the second differential wiring, whose stub is terminated at an upper layer than the third signal layer, and on which the first differential wiring is wired to pass through the third differential signal via. |
