| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting device which permits a circuit board and itself to be easily and firmly joined together via small solder lands and also can reduce poor bonding.SOLUTION: The light-emitting device includes a substrate 11 having an almost rectangular mounting portion, including a notched portion, at opposite ends thereof, a light-emitting element 13 mounted on the substrate, and electrode layers formed on bonding surfaces which are side faces of the substrate perpendicular to the light-emitting element mounted face and exposed to the notched portions. The mounting portions 15A and 15B each include an electrode non-formed portion 19 in which no electrode layer is formed over a side constituted by the end face and the bonding face of the mounting portion. |
