THERMOSETTING ADHESIVE COMPOSITION, AND HEAT-RESISTANT ADHESIVE FILM AND WIRING FILM EACH USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition high in storage stability, reliability and low-temperature adhesivity, and to provide a hard-to-curl heat-resistant adhesive film and wiring film each using the same.SOLUTION: A thermosetting adhesive composition is characterized by comprising: 100 pts.wt. of a phenoxy resin having in the structure a bisphenol S-type skeleton, ≥5 pts.wt. and ≤30 pts.wt. of a maleimide compound having in the structure a plurality of maleimide groups; and ≥3 vol.% and ≤20 vol.% of an inorganic needle-like filler. A heat-resistant adhesive film obtained by coating the composition on a polyimide film followed by drying, and a wiring film obtained by laying a conductor wiring layer on such a heat-resistant adhesive film, are also provided.