| 摘要 |
THE INVENTION RELATES TO A MOULD PART (10, 20) FOR APPLYING IN A DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS (38) MOUNTED ON A CARRIER, COMPRISING: AT LEAST ONE MOULD CAVITY (11, 21, 40) RECESSED INTO A CONTACT SIDE (28), A CONTACT SURFACE (12) AT LEAST PARTIALLY ENCLOSING THE MOULD CAVITY (11, 21, 40) FOR MEDIUM TIGHT CONNECTION TO THE CARRIER OF THE ELECTRONIC COMPONENT (38), A FEED CHANNEL (13, 42) FOR ENCAPSULATING MATERIAL (26, 34) RECESSED INTO THE CONTACT SURFACE (12) AND CONNECTING TO THE MOULD CAVITY (11, 21, 40) A FIRST OUTLET CHANNEL (26, 41) FOR GAS, AND AN EXTRACTION SPACE (22, 43) RECESSED INTO THE CONTACT SURFACE (12). THE INVENTION ALSO RELATES TO A DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS (38) MOUNTED ON A CARRIER AND TO A METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS (38) MOUNTED ON A CARRIER. |
