| 摘要 |
<p>Method for Stripping a Product Substrate from a Carrier Substrate AbstractThe invention relates to a method for stripping a product substrate (7) from a carrier substrate (3) which is connected to the product substrate (7) by an interconnect layer (6) with the following steps, especially the following sequence:application of solvents (9) to one flat side (3o) of the carrier substrate (3) facing away from the interconnect layer (6),flow of a throughflow portion of the solvent (9) through the carrier substrate (3),at least partial detachment of the interconnect layer (6), predominantly by the throughflow portion andstripping of the product substrate (7) from the carrier substrate (3).Figure 2</p> |
