发明名称 RESIN SHEET WITH COPPER FOIL, MULTILAYER PRINTED WIRING BOARD, METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE
摘要 A RESIN SHEET (1) WITH A COPPER FOIL, COMPRISING: A CARRIER LAYER (11); A COPPER FOIL LAYER ( 12) HAVING A THICKNESS 0.5 TO 5 µM PROVIDED OVER THE CARRIER LAYER (11); AND AN INSULATING RESIN LAYER (13) FORMED OVER THE COPPER FOIL LAYER (12), WHEREIN THE INSULATING RESIN LAYER (13 ) IS ONCE ABUTTED WITH BASE MATERIAL (2), AND THEN THE CARRIER LAYER (11) IS DELAMINATED FROM THE COPPER FOIL LAYER (12), AND WHEREIN THE INSULATING RESIN LAYER (13) CONTAINS A CYANATE ESTER RESIN HAVING PHENOLIC NOVOLAC BACKBONE AND A POLYFUNCTIONAL EPOXY RESIN.
申请公布号 MY149431(A) 申请公布日期 2013.08.30
申请号 MY2010PI04103 申请日期 2009.03.19
申请人 SUMITOMO BAKELITE CO., LTD. 发明人 OHIGASHI, NORIYUKI
分类号 B32B15/08 主分类号 B32B15/08
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