发明名称 LAMINATED SHEET FOR PACKAGING ELECTRONIC COMPONENT AND MOLDED BODY THEREOF
摘要 <p>-20-The present invention discloses a laminated sheet for packaging electronic components comprising a front surface layer, a center core layer and a rear surface layer, wherein the front surface layer and the rear surface layer each contains a rubber-modified styrenic copolymer (A) having a graft ratio of grafted rubber of 30 to 50%, a grafted rubber particle diameter of 0.1 to 0.5 µm and a butadiene content of 5 to 25% by weight, and polyetheresteramide (B), and the center core layer contains a rubber-modified styrenic copolymer (C) having a graft ratio of grafted rubber of 70 to 90%, a grafted rubber particle diameter of 0.4 to 1.0 F.A.m, and a butadiene content of 5 to 15% by weight, and 5 to 50 % by weight of a recycled material of this laminated sheet. The laminated sheet is well balanced in physical properties such as antistatic properties, transparency, folding strength, etc., and even if a recycled material is added to the center core layer, visibility in the inspection through a carrier tape is favorable, and thus, the laminated sheet can be preferably used for preparing a sheet for packaging electronic components, such as embossed carrier tape, etc.No Figure</p>
申请公布号 SG192127(A1) 申请公布日期 2013.08.30
申请号 SG20130056585 申请日期 2012.01.25
申请人 DENKI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 FUJIWARA JUNPEI;KAWATA MASATOSHI;MIYAMURA YASUSHI
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