HIGH RELIABLE AND HIGH POWER LED PACAGE WITH LCP WALL AND THE PRODUCTION METHOD

摘要

PURPOSE: A high reliability and high power LED package with an LCP wall and a manufacturing method thereof are provided to reduce costs by using a molding body consisting of synthetic resin. CONSTITUTION: A substrate includes an electrode part (500) and an insulation part (400). An LED chip and the electrode part are connected by an electrode connection line (700). A resin storage part consists of synthetic resin injection-molded on the substrate. A resin lens part (320) is formed inside the upper part of the resin storage part. The resin lens part is formed by a dispense mode using surface tension.