CHIP CAPACITOR AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a chip capacitor and a manufacturing method of the same, which can easily and immediately cope with a plurality of capacitance values by a common layout.SOLUTION: A chip capacitor 1 comprises: a substrate 2; a first external electrode 3 and a second external electrode 4 which are arranged on the substrate 2; capacitor elements C1-C19 and fuses F1-F9. The capacitor elements C1-C19 include: a first electrode film 11; a first capacitance film 12 on the first electrode film 11; a second electrode film 13 opposite to the first electrode film 11 on the first capacitance film 12; a second capacitance film 17 on the second electrode film 13; and a third electrode film 16 opposite to the second electrode film 13 on the second capacitance film 17. The capacitor elements C1-C19 are connected between the first external electrode 3 and the second external electrode 4. Each of the fuses F1-F9 is placed between the capacitor elements C1-C19 and the first external electrode 3 or the second external electrode 4. And the plurality of capacitor elements C1-C19 can be separated.