| 摘要 |
PURPOSE: A multilayer wiring board and an electronic device are provided to reduce crosstalk by arranging a third differential wiring connected to first signal via pairs on a signal layer disposed below a fourth differential wiring. CONSTITUTION: A first differential wiring is wired to a third signal layer. A second differential wiring (30B) is wired to a ninth signal layer disposed above the third signal layer. A first differential signal via (12A) and a second differential signal via (12B) are connected to the first differential wiring and the second differential wiring, respectively. A third differential signal via (12C) is connected to the second differential wiring, and a stub of which is terminated above the third signal layer. A fourth differential signal via (12D) is connected to the second wiring, a stub of which is terminated above the third signal layer, and the first differential wiring is wired to pass between the fourth differential signal via and the third differential signal via. |
