发明名称 METAL POWDER PASTE AND METHOD FOR PRODUCING SAME
摘要 <p>Provided are a surface-treated metal powder paste which can be suitably used for producing an electrode for a multilayer ceramic chip capacitor and has excellent sintering delaying properties, and a method for producing the same. The present invention is provided by a metal powder paste which comprises: a surface-treated metal powder in which the adhesion amount of at least one of Si, Ti, Al, Zr, Ce and Sn is 200 to 16000 µg with respect to 1 g of metal powder and N is 0.02% or greater in wt% with respect to the metal powder; and an organic substance having a carboxyl group, the surface-treated metal powder and the organic substance being dispersed in a solvent.</p>
申请公布号 WO2013125659(A1) 申请公布日期 2013.08.29
申请号 WO2013JP54415 申请日期 2013.02.21
申请人 JX NIPPON MINING & METALS CORPORATION 发明人 FURUSAWA,HIDEKI
分类号 H01B1/22;B22F1/02;H01B1/00;H01B13/00;H01G4/232;H01G4/30 主分类号 H01B1/22
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