| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric element in which thermoelectric materials are bonded strongly without using solder.SOLUTION: An inter-material inter-electrode bonding layer Lam is formed by sintering a paste containing metallic particles smaller than 100 nm. In the sintering process, the metallic particles smaller than 100 nm contained in an organic solvent are coarsened to bring about a state where metallic particles of 1 μm or larger are observed. Since the inter-material inter-electrode bonding layer Lam after sintering contains metallic particles of 1 μm or larger, the metallic particles are not coarsened at the sintering temperature thus stabilizing the inter-material inter-electrode bonding layer Lam. Since the inter-material inter-electrode bonding layer Lam contains metallic particles of 1 μm or larger, bonding between metallic particles is strengthened when compared with that before sintering. |
