THREE LAYER STRUCTURE LAMINATE DIAMOND BASED SUBSTRATE, HEAT RADIATION MOUNTING SUBSTRATE FOR POWER SEMICONDUCTOR MODULE, AND MANUFACTURING METHODS OF THREE LAYER STRUCTURE LAMINATE DIAMOND BASED SUBSTRATE AND HEAT RADIATION MOUNTING SUBSTRATE FOR POWER SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To provide a heat radiation mounting substrate for a power semiconductor module which has heat radiation characteristics that is excellent in heat conduction, achieves sufficient joint strength between a device body and a cooler, and has an excellent conductive feeder line, and to provide a manufacturing method of the heat radiation mounting substrate.SOLUTION: A three layer structure laminate diamond based substrate includes a diamond based material layer 2-2 and diamond based material films 2-1, 2-2 that are materials different from the diamond based material layer and are provided on both surfaces of the diamond based material layer in a thickness direction. The three layer structure laminate diamond based substrate and a manufacturing method of the three layer structure laminate diamond based substrate are provided for achieving the above object.