System in Package and Method for Manufacturing The Same

摘要

A system in package and a method for manufacturing the same is provided. The system in package comprises a laminate body having a substrate arranged inside a laminate body. A semiconductor die is embedded in the laminate body and the semiconductor is bonded to contact pads of the substrate by help of a sintered bonding layer, which is made from a sinter paste. Lamination of the substrate and further layers providing the laminate body and sintering of the sinter paste may be performed in a single and common curing step.