发明名称 CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide: a conductive particle capable of effectively lowering connection resistance in electrically connecting between electrodes; and a conductive material including the conductive particle.SOLUTION: A conductive particle 1 according to the present invention includes: a base material particle 2; a first conductive layer 3 disposed on the surface of the base material particle 2, and containing 80 wt.% or more of nickel; a second conductive layer 4 disposed on the external surface of the first conductive layer 3, and containing 80 wt.% or more of palladium; and a third conductive layer 5 disposed on the external surface of the second conductive layer 4, and containing nickel and palladium. A conductive material according to the present invention includes the conductive particle 1 and a binder resin.
申请公布号 JP2013168359(A) 申请公布日期 2013.08.29
申请号 JP20130002809 申请日期 2013.01.10
申请人 SEKISUI CHEM CO LTD 发明人 O GYOKA
分类号 H01B5/00;B22F1/02;C09C3/06;C22C5/04;C22C19/03;H01B1/00;H01B1/22;H01B5/16;H01R11/01 主分类号 H01B5/00
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