发明名称 METHOD OF FORMING NITROGEN-FREE DIELECTRIC ANTI-REFLECTION LAYER
摘要 The present invention provides a method of forming a nitrogen-free dielectric anti-reflection layer comprising: introducing a reaction gas into the discharge tube until the reaction gas reaching a stable state; introducing the reaction gas into the reaction chamber and then generating a plasma, or generating a plasma and then introducing the reaction gas into the reaction chamber, wherein the time delay occurs between the two processes is utilized to perform the deposition of the nitrogen-free dielectric anti-reflection layer; finally stop introducing the reaction gas and then stop generating the plasma. The method can flexibly control the extinction coefficient and the refractive index of the nitrogen-free dielectric anti-reflection layer so as to obtain a straight photoresist pattern and greatly reduce the photoresist standing waves effect and photoresist poisoning effect.
申请公布号 US2013224399(A1) 申请公布日期 2013.08.29
申请号 US201213721062 申请日期 2012.12.20
申请人 SHANGHAI HUALI MICROELECTRONICS CORPORATION;SHANGHAI HUALI MICROELECTRONICS CORPORATION 发明人 CHEN CHIENWEI;CHANG HSUSHENG
分类号 C23C16/50 主分类号 C23C16/50
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