发明名称 |
METHOD OF FORMING NITROGEN-FREE DIELECTRIC ANTI-REFLECTION LAYER |
摘要 |
The present invention provides a method of forming a nitrogen-free dielectric anti-reflection layer comprising: introducing a reaction gas into the discharge tube until the reaction gas reaching a stable state; introducing the reaction gas into the reaction chamber and then generating a plasma, or generating a plasma and then introducing the reaction gas into the reaction chamber, wherein the time delay occurs between the two processes is utilized to perform the deposition of the nitrogen-free dielectric anti-reflection layer; finally stop introducing the reaction gas and then stop generating the plasma. The method can flexibly control the extinction coefficient and the refractive index of the nitrogen-free dielectric anti-reflection layer so as to obtain a straight photoresist pattern and greatly reduce the photoresist standing waves effect and photoresist poisoning effect.
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申请公布号 |
US2013224399(A1) |
申请公布日期 |
2013.08.29 |
申请号 |
US201213721062 |
申请日期 |
2012.12.20 |
申请人 |
SHANGHAI HUALI MICROELECTRONICS CORPORATION;SHANGHAI HUALI MICROELECTRONICS CORPORATION |
发明人 |
CHEN CHIENWEI;CHANG HSUSHENG |
分类号 |
C23C16/50 |
主分类号 |
C23C16/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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