| 摘要 |
A test supporting method, loading method, turn over buffer apparatus and carrier board turn apparatus of handling system for supporting test of die are provided to make a stable electric contact of a die and a socket by preventing the separation of die from the carry board. In an A-step, a die which is puts on a wafer is turned by 180 degrees(S1712). In a B-stage, loads the rotated die through the A-step to the carrier board(S1713). In a C-stage, the carrier board which is loaded completely is turned by 180 degrees(S1720). In a D step, a test for the die loaded on the carry board by making the die loaded in the carry board contact with a tester electrically(S1730). In an E-step, the die which is tested completely is unloaded from the carry board(S1740). |
