MULTI-LAYERED PRINTED CIRCUIT BOARD

摘要

The invention relates to a multi-layered printed circuit board (12), an LED arrangement (10) and a method, which combine a high level of integration with improved heat dissipation. The claimed multi-layered printed circuit board (12) comprises at least one first and one second layer (18), each of which comprises electrically-conductive conductor tracks and/or surfaces and which are separated from each other by means of at least one electrically-insulating layer (20). The at least one first and the at least one second layer (18) are connected in an electrically-conductive manner by means of at least one connecting element (24). The multi-layered printed circuit board (12) comprises at least one third layer (22) that is formed from an electrically-conductive material and is arranged between the at least one first and the at least one second layer (18), said third layer (22) being separated from both the first and the second layer (18) by means of at least one electrically-insulating layer (20). The connecting element (24) between the first and the second layer (18) penetrates this third layer (22) and is electrically insulated therefrom.