| 摘要 |
PROBLEM TO BE SOLVED: To provide an LED package which has a superior heat dissipation property and a compact structure and is immune to heat shock and mechanical shock.SOLUTION: An LED package comprises a first sheet metal including a first electrode and a second electrode which are spaced apart from each other, a second sheet metal including a first terminal and a second terminal which are spaced apart from each other, an insulating layer which is interposed between the first sheet metal and the second sheet metal and includes a first opening and a second opening formed therein, a first via conducting part with which the first opening is filled for connecting the first electrode and the first terminal, a second via conducting part with which the second opening is filled for connecting the second electrode and the second terminal, a hole cup which is disposed on the first sheet metal and includes a third opening exposing the first electrode and the second electrode, an LED chip which is positioned within the third opening, and a sealing member disposed on the hole cup so as to cover the third opening. |
