GRANULAR EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR, SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a granular epoxy resin composition for encapsulating a semiconductor excellent in productivity when a semiconductor device is obtained by encapsulating a semiconductor element by compression molding by using the granular epoxy resin composition for encapsulating the semiconductor, and a semiconductor device excellent in reliability.SOLUTION: An epoxy resin composition for encapsulating a semiconductor is used for a semiconductor device obtained by encapsulating a semiconductor element by compression molding, wherein in the particle size distribution measured by sieving using a JIS standard sieve, with respect to the whole epoxy resin composition for encapsulating a semiconductor, the proportion of particles of ≥2 mm is ≤3 mass%; the proportion of particles of ≥1 mm and <2 mm is ≥0.5 mass% and ≤60 mass%; and the proportion of fine powder of <106 μm is ≤5 mass%.