发明名称 SURFACE TREATMENT APPARATUS, SURFACE TREATMENT METHOD AND METHOD FOR MANUFACTURING BONDING WIRE
摘要 PROBLEM TO BE SOLVED: To provide a surface treatment apparatus, a surface treatment method and a method for manufacturing a bonding wire, which reduce a surface area of an electrode in a treatment tank to reduce deterioration of a treatment liquid and also reduce consumption amount of noble metal.SOLUTION: A surface treatment apparatus includes: a treatment tank 20 for storing a treatment liquid 30; guide rollers 50, 51 for transmitting metal wires so that the metal wires 10 move in a horizontal direction in the treatment liquid; and wire-shaped electrode wires 60, 61 arranged on upper and lower sides of the metal wires in parallel with the metal wires.
申请公布号 JP2013167008(A) 申请公布日期 2013.08.29
申请号 JP20120032087 申请日期 2012.02.16
申请人 SUMITOMO METAL MINING CO LTD 发明人 IPPONMATSU SHOJI
分类号 C25D7/06;C25D21/00 主分类号 C25D7/06
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