| 摘要 |
PURPOSE: A semiconductor device is provided to easily arrange an electrical connection between a semiconductor die and a circuit substrate by forming conductive filler by penetrating encapsulation materials. CONSTITUTION: A plurality of bond pads(411) is formed on the lower surface of a first semiconductor die(410). A plurality of bond pads(421) is formed on the upper surface of a second semiconductor die(420). A conductive bump(430) electrically connects a redistribution layer(412) of the first semiconductor die and a redistribution layer(422) of the second semiconductor die. An under-filling material(440) is filled between the first semiconductor die and the second semiconductor die. A solder ball(460) electrically connects the first semiconductor die and the second semiconductor die to an external apparatus. |
