发明名称 |
OVERLAY MEASURING METHOD, MEASURING DEVICE, SCANNING ELECTRON MICROSCOPE AND GUI |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for easily and robustly measuring an overlay in an area where an actual device circuit pattern is formed in manufacturing a semiconductor device.SOLUTION: An overlay measuring method is a method for measuring an overlay of a semiconductor device in which a circuit pattern is formed through a plurality of times of exposure step. The method includes: an image pickup step of picking up images of a plurality of areas of the semiconductor device; a reference image setting step of setting a reference image from among the plurality of picked-up images which are picked up in the image pickup step; a difference quantification step of quantifying a difference between the reference image set in the reference image setting step and the plurality of picked-up images which are picked up in the image pickup step; and an overlay calculation step of calculating the overlay based on the difference quantified in the difference quantification step. |
申请公布号 |
JP2013168595(A) |
申请公布日期 |
2013.08.29 |
申请号 |
JP20120032307 |
申请日期 |
2012.02.17 |
申请人 |
HITACHI HIGH-TECHNOLOGIES CORP |
发明人 |
HARADA MINORU;NAKAGAKI AKIRA;FUKUNAGA FUMIHIKO;TAKAGI YUJI |
分类号 |
H01L21/66;H01L21/027 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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