发明名称 PRINTED CIRCUIT BOARD AND MEMORY MODULE COMPRISING THE SAME
摘要 A printed circuit board (PCB) comprises an internal wiring layer, an insulating layer on the internal wiring layer, a via hole extending through the insulating layer, and an external wiring layer on the insulating layer. The internal wiring layer comprises at least one metal wiring layer. The via hole exposes the internal wiring layer. The external wiring layer is electrically connected to the internal wiring layer. The external wiring layer includes a mounting area on which a semiconductor chip is disposed and a non-mounting area on which a semiconductor chip is not disposed. A thickness of the mounting area is less than a thickness of the non-mounting area.
申请公布号 US2013223001(A1) 申请公布日期 2013.08.29
申请号 US201213685076 申请日期 2012.11.26
申请人 SAMSUNG ELECTRONICS CO., LTD.;SAMSUNG ELECTRONICS CO., LTD. 发明人 RYU HWANG-BOK;KO JUN-YOUNG;KIM YOUNG-JA;JEONG DAE-YOUNG
分类号 H05K7/06;G06F1/16 主分类号 H05K7/06
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