SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND ELECTRONIC APPARATUS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To reduce the number of man hour required for manufacturing of a semiconductor device and to reduce cost.SOLUTION: A semiconductor device manufacturing method comprises: a process of arranging an adhesive layer 20 on a support medium 10; a process of arranging a semiconductor element 30 on the adhesive layer 20; a process of arranging a resin layer 40 on the adhesive layer 20 to form a pseudo wafer 50; and a process of removing the pseudo wafer 50 from the adhesive layer 20. A material having adhesion in a removing direction T of the pseudo wafer 50 is weaker than adhesive in a planar direction S in which the pseudo wafer 50 is formed is used as the adhesive layer 20. Processing for decreasing adhesion of the adhesive layer 20 can be omitted at the time of removing the pseudo wafer 50 making the adhesive layer 20 reusable thereby to reduce the number of man hour required for manufacturing of the semiconductor device and to reduce cost.