发明名称 SEMICONDUCTOR DEVICE AND COOLING SYSTEM THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device capable of obtaining a required heat source, while suppressing reduction in travelable distance, in a power-driven body which uses electric power as a motive force source, and a cooling system therefor.SOLUTION: A semiconductor device relating to the present invention is a semiconductor device 1 available for a cooling system comprising an ECU 7 as a setting section which sets a target temperature of a coolant to be used for cooling the semiconductor device 1 and a sensor 24 as a detection section which detects the temperature of the coolant as a coolant temperature. For the semiconductor device 1, a heating loss is variable and a heating control section 22 is provided which controls the heating loss in the semiconductor device 1 in such a manner that a target temperature and the coolant temperature are matched.
申请公布号 JP2013168614(A) 申请公布日期 2013.08.29
申请号 JP20120032544 申请日期 2012.02.17
申请人 MITSUBISHI ELECTRIC CORP 发明人 MIYAMOTO NOBORU;AIKO MITSUNORI
分类号 H05K7/20;B60H1/03 主分类号 H05K7/20
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