发明名称 |
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD |
摘要 |
A printed circuit board includes an inner substrate, a stuffing layer, an adhesive layer and a plurality of second copper trace layer. The inner substrate includes an insulating layer and an copper trace layer formed on a surface of the insulating layer. The first surface includes a low copper density region. In the low copper density region, the area of first surface covered by the copper trace layer is less than 60 percent of the area of the low copper density region. The stuffing layer is only formed on the first inner substrate in the region. The present disclosure also provides a method for manufacturing the printed circuit board.
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申请公布号 |
US2013220683(A1) |
申请公布日期 |
2013.08.29 |
申请号 |
US201213537073 |
申请日期 |
2012.06.29 |
申请人 |
CAI ZONG-QING;ZHEN DING TECHNOLOGY CO., LTD.;HONG HENG SHENG ELECTRONICAL TECHNOLOGY (HUAIAN)CO.,LTD |
发明人 |
CAI ZONG-QING |
分类号 |
H05K1/09;H05K3/02;H05K3/12 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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