| 摘要 |
A thermoelectric module having a compact design and high thermal resistance, which requires less semiconductor material in comparison to a conventional thermoelectric module with comparable output comprises - a substrate (11) having a substrate front side (11a) and a substrate rear side (11b) opposite the substrate front side (11a), - a plurality of thermoelectric elements (12a) having a first thermoelectrically active material (18) and contacts (16a, 16b) for electrically and thermoelectrically contacting the first thermoelectrically active material (18) on the hot and cold side (14, 15), wherein each thermoelectric element (12a) is applied as a layer to the substrate front side (11a), - a plurality of thermoelectric elements (12b) having a second thermoelectrically active material (21) and contacts (19a, 19b) for electrically and thermally contacting the thermoelectrically active material (21) on the hot and cold side (14, 15), wherein each thermoelectric element (12b) is applied as a layer to the substrate rear side (11b), - and electrically conductive connections between the thermoelectric elements (12a, 12b) on the substrate front side (11a) and substrate rear side (11b). A method for cost-effectively producing such a thermoelectric module is also disclosed. |
