| 发明名称 |
SYSTEM IN PACKAGE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
<p>A system in package and a method for manufacturing the same is provided. The system in package comprises a laminate body having a substrate (4) arranged inside a laminate body. A semiconductor die (2) is embedded in the laminate body and the semiconductor is bonded to contact pads (6) of the substrate (4) by help of a sintered bonding layer, which is made from a sinter paste. Lamination of the substrate and further layers providing the laminate body and sintering of the sinter paste may be performed in a single and common curing step.</p> |
| 申请公布号 |
WO2013126893(A1) |
申请公布日期 |
2013.08.29 |
| 申请号 |
WO2013US27656 |
申请日期 |
2013.02.25 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED;TEXAS INSTRUMENTS DEUTSCHLAND GMBH;TEXAS INSTRUMENTS JAPAN LIMITED |
发明人 |
LANGE, BERNHARD;NEUHAUSLER, JURGEN |
| 分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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