发明名称 RESIN MULTILAYER SUBSTRATE
摘要 <p>A resin multilayer substrate (101) is provided with: a resin structure (3) formed by a plurality of resin layers (2) being laminated; and one or more disposed components (4), which are either built-in components disposed so as to be embedded within the resin structure (3) or mounted components which are mounted on the surface of the resin structure (3). The resin structure (3) includes: a flexible part (21) in which a first lamination number of resin layers (2) are laminated; and a rigid part (22) in which a second number of resin layers (2), which is larger than the first number of laminated layers, are laminated. Viewed in a planar manner, the flexible part (21) has a shape that is not a rectangle and one or more disposed components (4), which are closest to the boundary line of the flexible part (21) and the rigid part (22), are disposed such that the edges nearest the boundary line are parallel to the boundary line.</p>
申请公布号 WO2013125559(A1) 申请公布日期 2013.08.29
申请号 WO2013JP54128 申请日期 2013.02.20
申请人 MURATA MANUFACTURING CO., LTD. 发明人 SAKAI, NORIO;OTSUBO, YOSHIHITO
分类号 H05K3/46 主分类号 H05K3/46
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