发明名称 |
METHOD FOR REPAIRING CONNECTION PART IN CONNECTED BODY, AND REPAIR CUTTER FOR USE IN SAID METHOD |
摘要 |
<p>Provided is a repairing method in which two substrates which have been connected to each other with an electrically conductive adhesive layer interposed therebetween are separated and the substrates are re-connected to each other with another anisotropic electrically conductive film using at least one of the substrates. Prior to the re-connection of the two substrates, any residue (31) present on the substrate (11) to be re-used or a connection terminal (12) is removed using a repair cutter (40) having an elastic modulus of 2.1 to 3.7 GPa inclusive at a tip part (41) thereof.</p> |
申请公布号 |
WO2013125413(A1) |
申请公布日期 |
2013.08.29 |
申请号 |
WO2013JP53409 |
申请日期 |
2013.02.13 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
YAMAMOTO, MASAMICHI;OTANI, JUN;OKUDA, YASUHIRO;SATO, KATSUHIRO |
分类号 |
H05K3/32;H01L21/60 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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