| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing a short circuit between bonding wires, between device pads, or between the bonding wire and the device pad due to peeling off of a cut-off residue of a scribe TEG pad from an edge of a semiconductor chip.SOLUTION: In a semiconductor device, a scribe TEG pad 3 on a semiconductor wafer 60 is formed of a plurality of rectangular pads within a scribe line 1 each extending toward a device forming region 2. The semiconductor wafer 60 is divided into semiconductor chips by dicing. In the dicing, a length of each of cut-off residues of the scribe TEG pad 3 remaining on an edge of the semiconductor chip 60 is made shorter than an interval between edges of openings 40a in a passivation film 40 on adjacent device pads 4. |
