| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting device and a mounting method in which highly precise mounting operation in a manufacturing process of a chip laminated body can be achieved at low cost.SOLUTION: After a chip 1 is picked up by a collet 3 in a pickup position, a chip rear surface image is acquired by a chip recognition camera 6 which has recognized the chip 1 in the pickup position through a reflective inverse mechanism 21, in an eccentricity quantity detection position which is shifted from the pickup position. Then, the collet 3 which sucks the chip 1 is rotated for a predetermined angle in the eccentricity quantity detection position. In this status, the chip rear surface image is acquired again by the chip recognition camera 6 through the reflective inverse mechanism 21. Afterward, a rotation eccentricity quantity of the chip 1 is calculated using chip rear surface image data acquired before the rotation and chip rear surface image data acquired after the rotation. |
