| 发明名称 |
ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE |
| 摘要 |
<p>Provided is an adhesive for a semiconductor that contains an epoxy resin, a curing agent, and a compound having the group represented by formula (1). [In the formula, R1 indicates an electron-donating group.]</p> |
| 申请公布号 |
WO2013125086(A1) |
申请公布日期 |
2013.08.29 |
| 申请号 |
WO2012JP75412 |
申请日期 |
2012.10.01 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
HONDA KAZUTAKA;NAGAI AKIRA;SATOU MAKOTO |
| 分类号 |
H01L21/52;B23K35/363;C08L63/00;H01L21/60;H01L23/29;H01L23/31 |
主分类号 |
H01L21/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
