发明名称 |
MEMORY MODULE AND ON-DIE TERMINATION SETTING METHOD THEREOF |
摘要 |
A memory system includes a plurality of memory devices on a printed circuit board, each of the memory devices including a plurality of external pads; a plurality of connection terminals formed on the printed circuit board, and electrically connected to respective ones of the external pads; and a plurality of signal lines formed on the printed circuit board to connect the connection terminals with the external pads, each of the signal lines between a corresponding connection terminal and a corresponding external pad and having a length. The plurality of memory devices are arranged at different distances from the plurality of connection terminals, and each signal line that connects a connection terminal to an external pad of a memory device either is connected to or does not connect a stub resistor depending on a length of the line. |
申请公布号 |
US2013223123(A1) |
申请公布日期 |
2013.08.29 |
申请号 |
US201313772895 |
申请日期 |
2013.02.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD.;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JAEJUN;KIM BO-RA;BAEK JEONGHOON |
分类号 |
G11C5/06 |
主分类号 |
G11C5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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