| 摘要 |
PROBLEM TO BE SOLVED: To provide a heating device which is capable of suppressing deformation of a reflection member when a heating temperature of a wafer is high.SOLUTION: A heating device 100 includes a heater 20, a heater support 30, a reflection member 40, and a wafer support 50. The reflection member 40 is provided on the rear surface 32 side of the heater support 30. The light transmittance of the heater support 30 is 10% or less. |
