发明名称 HEAD UNIT, ULTRASONIC PROBE, ELECTRONIC INSTRUMENT, AND DIAGNOSTIC DEVICE
摘要 A head unit for an ultrasonic probe includes a connecting section, an element chip and a supporting member. The connecting section is configured to electrically connect the head unit to a probe main body of the ultrasonic probe. The element chip is configured to be electrically connected to the probe main body through the connecting section. The element chip includes a substrate and an ultrasonic element array. The substrate defines a plurality of openings arranged in an array pattern. The ultrasonic element array includes a plurality of ultrasonic transducer elements, with each of the ultrasonic transducer elements being provided in each of the openings of the substrate. The supporting member supports the element chip.
申请公布号 US2013223193(A1) 申请公布日期 2013.08.29
申请号 US201313774223 申请日期 2013.02.22
申请人 SEIKO EPSON CORPORATION;SEIKO EPSON CORPORATION 发明人 TAKAHASHI MASAKI
分类号 B06B1/06 主分类号 B06B1/06
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