发明名称 A METHOD FOR PLATING A COMPONENT
摘要 <p>A method for selectively plating a connector pin, the method comprising the steps of: providing said connector pin; applying a layer of a barrier metal to said connector pin; applying a photo-resist material to said connector pin, then; selectively exposing a portion of the photo-resist material so as to impart a pattern on the exposed portion; removing unexposed photo-resist material; applying a layer of precious metal to the connector pin such that said precious metal layer is applied to the exposed portion only.</p>
申请公布号 WO2013126018(A1) 申请公布日期 2013.08.29
申请号 WO2013SG00073 申请日期 2013.02.22
申请人 ROKKO LEADFRAMES PTE LTD 发明人 SINGH, PARAMGEET;YARANIAN, RAVI
分类号 C25D5/02;G03F7/00;H01L21/3213;H01L23/495;H01L23/525 主分类号 C25D5/02
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