发明名称 |
A METHOD FOR PLATING A COMPONENT |
摘要 |
<p>A method for selectively plating a connector pin, the method comprising the steps of: providing said connector pin; applying a layer of a barrier metal to said connector pin; applying a photo-resist material to said connector pin, then; selectively exposing a portion of the photo-resist material so as to impart a pattern on the exposed portion; removing unexposed photo-resist material; applying a layer of precious metal to the connector pin such that said precious metal layer is applied to the exposed portion only.</p> |
申请公布号 |
WO2013126018(A1) |
申请公布日期 |
2013.08.29 |
申请号 |
WO2013SG00073 |
申请日期 |
2013.02.22 |
申请人 |
ROKKO LEADFRAMES PTE LTD |
发明人 |
SINGH, PARAMGEET;YARANIAN, RAVI |
分类号 |
C25D5/02;G03F7/00;H01L21/3213;H01L23/495;H01L23/525 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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