发明名称 |
SENSORE MICROELETTROMECCANICO CON RILEVAMENTO FUORI PIANO E PROCEDIMENTO PER LA FABBRICAZIONE DI UN SENSORE MICROELETTROMECCANICO |
摘要 |
A microelectromechanical sensor that in one embodiment includes a supporting structure, having a substrate and electrode structures anchored to the substrate; and a sensing mass, movable with respect to the supporting structure so that a distance between the sensing mass and the substrate is variable. The sensing mass is provided with movable electrodes capacitively coupled to the electrode structures. Each electrode structure comprises a first fixed electrode and a second fixed electrode mutually insulated by a dielectric region and arranged in succession in a direction substantially perpendicular to a face of the substrate. |
申请公布号 |
ITTO20120179(A1) |
申请公布日期 |
2013.08.29 |
申请号 |
IT2012TO00179 |
申请日期 |
2012.02.28 |
申请人 |
STMICROELECTRONICS S.R.L. |
发明人 |
SIMONI BARBARA;VALZASINA CARLO |
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