发明名称 SENSORE MICROELETTROMECCANICO CON RILEVAMENTO FUORI PIANO E PROCEDIMENTO PER LA FABBRICAZIONE DI UN SENSORE MICROELETTROMECCANICO
摘要 A microelectromechanical sensor that in one embodiment includes a supporting structure, having a substrate and electrode structures anchored to the substrate; and a sensing mass, movable with respect to the supporting structure so that a distance between the sensing mass and the substrate is variable. The sensing mass is provided with movable electrodes capacitively coupled to the electrode structures. Each electrode structure comprises a first fixed electrode and a second fixed electrode mutually insulated by a dielectric region and arranged in succession in a direction substantially perpendicular to a face of the substrate.
申请公布号 ITTO20120179(A1) 申请公布日期 2013.08.29
申请号 IT2012TO00179 申请日期 2012.02.28
申请人 STMICROELECTRONICS S.R.L. 发明人 SIMONI BARBARA;VALZASINA CARLO
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