| 摘要 |
PROBLEM TO BE SOLVED: To re-join a conductive fuse blown by laser trimming with a plating electrode in a plating process and prevent a plating liquid etc. from penetrating into a fuse blown part.SOLUTION: A second protection layer 11 covering a trimming element formation region 70 is formed at a semiconductor device 1 formed by a multilayer wiring structure and having a fuse blown groove 10a, formed by a conductive fuse 10 being blown by laser trimming, in a trimming element formation region 70. Then, a plating electrode 12 is formed at an exterior lead-out pad 7 formed by a top layer metal wiring. Subsequently, a third protection layer 13, which has an opening and covers the semiconductor substrate 1 including the second protection layer 11, is formed on the plating electrode 12. |
