COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a component mounting device capable of mounting multiple kinds of components by one mounting unit at a high throughput.SOLUTION: A component mounting device 100 has: plural component delivery tables 105 between a component supply section 101 and a printed circuit conveying path 110; plural component extraction heads 102 that can move above a region including the component supply section 101 and each component delivery table 105; and the same number of component mounting heads 108 as that of the component delivery tables 105 that can move above a region including the component delivery tables 105 and the printed circuit conveying path 110 without crossing with each other. The component extraction head 102 extracts a required component from the component supply section 101, and arranges it on a predetermined component delivery table 105. The component mounting head 108 acquires the component arranged on a corresponding component delivery table 105, and mounts it to a predetermined position of the printed circuit board.