ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

Provided is an adhesive for a semiconductor that contains an epoxy resin, a curing agent, and a fluxing agent that comprises a compound having either the group represented by formula (1-1) or formula (1-2). [In the formulas, R1 indicates an electron-donating group, and a plurality of R1 may be the same or different from one another.]