| 摘要 |
PROBLEM TO BE SOLVED: To provide an alkylsulfonated tetrazole compound to improve the adhesive force of a metal to an interlayer insulating prepreg and a substrate using a buildup film, a method for producing the same, an epoxy resin containing the same, and a substrate manufactured therefrom.SOLUTION: An alkylsulfonated tetrazole compound is represented by chemical formula 1 wherein Ris selected from 1-20C aliphatic or alicyclic alkyl groups, 1-20C aryl or aralkyl groups, 1-20C functional group-substituted alkyl or aryl groups, rings linked by an alkylene containing a heteroatom or no heteroatom, polymer compound groups, and derivatives thereof; and n is an integer of 1 to 6. |
