LEAD FRAME FOR MOUNTING LED ELEMENT, LEAD FRAME WITH RESIN, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND LEAD FRAME FOR MOUNTING SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a lead frame for mounting a semiconductor element capable of preventing deformation in handling.SOLUTION: In a lead frame 10 for mounting the LED element which includes frame body regions 13 and a large number of package regions 14 arranged in multiple rows and stages in the frame body regions 13, each of the large number of the package regions 14 include die pads 25 on which LED elements 21 are mounted and lead portions 26 adjacent to the die pads 25, and are connected to each other through dicing regions 15, and the die pad 25 in the one package region 14 and the lead portion 26 in the other package region 14 which is vertically adjacent to the one package region 14 are connected to each other by an inclined reinforcing piece 51 positioned in the dicing region 15.