| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive capable of achieving robust bonding of a resin material such as a polyolefin-based resin which can not be bonded by using a solvent or common adhesive, and applicable as a bonding technique in production of large-sized components or intricately structured components, and to provide a method for bonding resins using the adhesive.SOLUTION: An adhesive 1 is made by filling a bonding base 2 including a material having affinity with the base materials 5, 6 comprising a thermosetting or thermoplastic resin to be bonded with a pulverized dielectric heating medium 3 having an dielectric heating property, and is used for bonding the base materials to each other by heat-melting the bonding base 2 through dielectric heating of the medium 3 by a high-frequency dielectric heating system. Further, a granular or fibrous dielectric heating medium 4 which has the same dielectric heating property as the medium 3, can bite into the base materials 5, 6 by pressure, and exerts a mechanical strength as an anchor is blended in the bonding base 2. |
