发明名称 HEAT SEALING DEVICE AND HEAT SEALING METHOD
摘要 PROBLEM TO BE SOLVED: To heat-seal a specific section of an enveloping film without excessively heating a storage element in a heat sealing device for heat-sealing the enveloping film covering the storage element.SOLUTION: A heat sealing device 1 for heat-sealing a side surface of a workpiece W includes: a stage member 2 on which the workpiece is placed; an extrusion member 3 that is provided above the stage member and can extrude and secure the workpiece placed on the stage member by relative descent of the extrusion member 3 with respect to the stage member; a lifting means 15 for making the extrusion member relatively lift and move with respect to the stage member; and heating means 16, 17, 18, 19, 25, 26 for heating the side surface of the workpiece secured by the stage member and the extrusion member.
申请公布号 JP2013166287(A) 申请公布日期 2013.08.29
申请号 JP20120030309 申请日期 2012.02.15
申请人 TOKYO ELECTRON LTD 发明人 TERADA KAZUO
分类号 B29C65/20;H01M2/08;H01M10/058 主分类号 B29C65/20
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