发明名称 |
CAPILLARY EXCHANGE SYSTEM OF SEMICONDUCTOR WIRE BONDING |
摘要 |
A capillary exchange system of a semiconductor wire bonding includes a wire bond unit having a chuck that includes a holding portion for holding a capillary for semiconductor wire bonding, a holding release guide unit for mechanically acting on the chuck of the wire bond unit to allow the capillary to be held by the holding portion or released from the holding portion, and a capillary exchange unit for separating the capillary from the chuck of the wire bond unit and installing a new capillary in the chuck in cooperation with the holding release guide unit.
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申请公布号 |
US2013221071(A1) |
申请公布日期 |
2013.08.29 |
申请号 |
US201213728316 |
申请日期 |
2012.12.27 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD.;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM YOUNG SIK;KIM DOO JIN;HONG SUNG BOK;OH KI TAIK |
分类号 |
H01L21/67 |
主分类号 |
H01L21/67 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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